i-PAN T10 CoverLense

This ARM touch panel system is the ideal basis for the integration into customer-specific HMI solutions

The individual components are modularly designed and are available separately or as assembly units

Computing Units are based on Trizeps SODIMM 200 CPU modules and i-PAN T7 Baseboard

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  • Based on Trizeps VII with NXP i.MX 6 / Trizeps VIII with NXP i.MX 8M / Trizeps VIII Mini with NXP i.MX 8M Mini / Trizeps VIII Nano with NXP i.MX 8M Nano
  • 10.1 inch projected capacitive touchscreen LCD with 3 mm glass front
  • Wireless communication via Trizeps WiFi and Bluetooth (on request)
  • Extension connectors for Breakout Boards
  • Available with Microsoft Windows Embedded Compact 7, 2013 (only for Trizeps VII), Windows 10 IoT Core, Linux and Android operating systems
Technical modifications reserved, errors excepted | *beginning product life circle
Processors Trizeps VII: NXP i.MX 6 Quad, Dual, DualLite, Solo, SoloX ARM Cortex A9 up to 1.0 GHz
  Trizeps VIII: NXP i.MX 8M ARM Cortex A53 Quad up to 1.5 GHz, additional ARM Cortex M4
  Trizeps VIII Mini: NXP i.MX 8M Mini ARM Cortex A53 Quad up to 1.8 GHz, additional ARM Cortex M4
  Trizeps VIII Nano: NXP i.MX 8M Nano ARM Cortex A53 Quad up to 1.5 GHz, additional ARM Cortex M7
Compatible CPU-Modules Trizeps VII, Trizeps VIII, Trizeps VIII Mini, Trizeps VIII Nano
RAM Memory Trizeps VII: Up to 2 GByte DDR3-1066 (533MHz), 16/32/64 Bit 1 CS (4 GByte on request)
  Trizeps VIII and Trizeps VIII Mini: Up to 8 GByte LPDDR4-3200 RAM, 32 Bit
  Trizeps VIII Nano: Up to 8 GByte LPDDR4-3200 RAM, 16 Bit
Flash Storage Trizeps VII, Trizeps VIII, Trizeps VIII Mini, Trizeps VIII Nano: Onboard 4 Bit wide μSD Card Socket (recommendation) or onboard 8 Bit wide eMMC (not available at the same time), eMMC available in different memory sizes
Features Display: 10.1“ TFT-Display, 1280 x 800 pixel, 420 cd/qm, projected capacitive touchscreen, IPS technology, 3 mm glass front
  Interfaces FF version (Full Function): USB2.0 Host, μUSB2.0 OTG, RJ45 10/100 Mbit Ethernet, μSD Card Socket, 3,5 mm Headset Jack for Microphone and Headphone, Realtime Clock with Backup battery, LED, Powerfail Detection
  Interfaces LC-E version (Low Cost Extended): USB2.0 Host, RJ45 10/100 Mbit Ethernet, Realtime Clock with Backup Cap, LED, Powerfail Detection
Wireless Communication With Trizeps VII: Onboard WiFi-Bluetooth Module, IEEE 802.11 a/b/g/n/e/i/h/d/k/r/w, +18 dBm, 72 Mbps (20 MHz), up to 150 Mbps (40 MHz), Bluetooth 3.0+ EDR (optional)
  With Trizeps VIII and Trizeps VIII Mini: Onboard WiFi-Bluetooth Module, WLAN 2.4GHz/5Ghz, 802.11 a/b/g/n/ac 2x2 MU-MIMO / Bluetooth 5.0 (optional)
  With Trizeps VIII Nano: no WiFi/Bluetooth
Expandability for Breakout Boards Extension interfaces FF version: FFC connectors with USB, I2C, UART, CAN, Keys, Camera (Rasberry Pi) / Solderpads for SPI, Speaker (2.6 W Audio Amplifier), Headphone, Microphone
  Extension interfaces LC version: FFC connector with UART / Solderpads for SPI, Headphone, Microphone
General Details System Software Trizeps VII: E-Boot, U-Boot, Barebox, UEFI / Windows 10 IoT Core, Windows Embedded Compact 7, 2013 – Linux Kernel 3.035, 4.1, 4.4 – Ubuntu 14.04, 16.04, LXDE, Yocto – Android 4.2.2, 6.0
  System Software Trizeps VIII, Trizeps VIII Mini, Trizeps VIII Nano: Linux Kernel 4.14, Android 9, Windows 10 IoT Core (coming soon)
  Voltage Supply: Industrial +12 up to +24V supply / only for FF version (optional): Power over Ethernet (POE)
  Operating Temperature: -20°C to +70°C
  Dimensions i-PAN T10 Baseboard: 130.0 x 100.0 x 17.0 mm (W x H x D)
  Dimensions Display: 257.5 x 180.0 x 12.0 mm (W x H x D)
  Environmental Standard: RoHS, REACH, WEEE
  Availability: 10 years form, function*
  Order Codes (incl. i-PAN T10 Baseboard FF or LC, without Trizeps): i-PAN T10 CoverLens FF: 49 400.CL / i-PAN T10 CoverLens LC: 49 100.CL

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