i-PAN T7 CoverLense

This ARM touch panel system is the ideal basis for the integration into customer-specific HMI solutions

The individual components are modularly designed and are available separately or as assembly units

Computing Units are based on Trizeps SODIMM 200 CPU modules and i-PAN T7 Baseboard

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  • Based on Trizeps VII with NXP i.MX 6 – Trizeps VIII with NXP i.MX 8M – Trizeps VIII Mini/Nano/Plus with NXP i.MX 8M Mini/Nano/Plus
  • 7.0 inch projected capacitive touchscreen LCD with 1.8 mm glass front
  • Extension connectors for Breakout Boards
  • Wireless communication via Trizeps WiFi and Bluetooth (on request)
  • POE (Power Over Ethernet) available
  • Available with Microsoft Windows Embedded Compact 7, 2013 (only for Trizeps VII), Windows 10 IoT, Linux and Android operating systems
Technical modifications reserved, errors excepted | *beginning product life circle
Processors Trizeps VII: NXP i.MX 6 Quad, Dual, DualLite, Solo, SoloX ARM Cortex A9 up to 1.0 GHz
  Trizeps VIII: NXP i.MX 8M ARM Cortex A53 Quad up to 1.5 GHz, additional ARM Cortex M4
  Trizeps VIII Mini: NXP i.MX 8M Mini ARM Cortex A53 Quad up to 1.8 GHz, additional ARM Cortex M4
  Trizeps VIII Nano: NXP i.MX 8M Nano ARM Cortex A53 Quad up to 1.5 GHz, additional ARM Cortex M7
  Trizeps VIII Plus: NXP i.MX 8M Plus ARM Cortex A53 Quad up to 1.8 GHz, integrated ARM Cortex M7
Compatible CPU-Modules Trizeps VII, Trizeps VIII, Trizeps VIII Mini, Trizeps VIII Nano, Trizeps VIII Plus
RAM Memory Trizeps VII: Up to 2 GByte DDR3-1066 (533MHz), 16/32/64 Bit 1 CS (4 GByte on request)
  Trizeps VIII and Trizeps VIII Mini: Up to 8 GByte LPDDR4-3200, 32 Bit
  Trizeps VIII Plus: Up to 8 GByte LPDDR4-4000, 32 Bit
  Trizeps VIII Nano: Up to 8 GByte LPDDR4-3200, 16 Bit
Flash Storage Trizeps VII, Trizeps VIII, Trizeps VIII Mini/Nano/Plus: Onboard 4 Bit wide μSD Card Socket or onboard 8 Bit wide eMMC, eMMC available in different memory sizes
Features Display: 7.0 inch TFT-Display, 800 x 480 pixel, 850 cd/qm, projected capacitive touchscreen, 1,8 mm glass front
  Interfaces FF version (Full Function): USB2.0 Host, μUSB2.0 OTG, RJ45 10/100 Mbit Ethernet, μSD Card Socket, 3,5 mm Headset Jack for Microphone and Headphone, Realtime Clock with Backup battery, LED, Powerfail Detection
  Interfaces LC version (Low Cost): USB2.0 Host, RJ45 10/100 Mbit Ethernet, Realtime Clock with Backup Cap, LED, Powerfail Detection
Wireless Communication With Trizeps VII: Onboard WiFi-Bluetooth Module, IEEE 802.11 a/b/g/n/e/i/h/d/k/r/w, +18 dBm, 72 Mbps (20 MHz), up to 150 Mbps (40 MHz), Bluetooth 3.0+ EDR (optional)
  With Trizeps VIII, Trizeps VIII Mini/Plus: Onboard WiFi-Bluetooth Module, WLAN 2.4GHz/5Ghz, 802.11 a/b/g/n/ac 2x2 MU-MIMO, Bluetooth 5.0 (optional)
  With Trizeps VIII Nano: no WiFi/Bluetooth
Expandability for Breakout Boards Extension interfaces FF version (Full Function): FFC connectors with USB, I2C, UART, CAN, Keys, Camera (Raspberry Pi) / Solderpads for SPI, Speaker (2.6 W Audio Amplifier), Headphone, Microphone
  Extension interfaces LC version (Low Cost): FFC connector with UART / Solderpads for SPI, Headphone, Microphone
General Details System Software Trizeps VII: E-Boot, U-Boot, Barebox, UEFI / Windows 10 IoT Core, Windows Embedded Compact 7, 2013 – Linux, Android
  System Software Trizeps VIII, Trizeps VIII Mini/Nano/Plus: Linux, Android, Windows 10 IoT
  Voltage Supply: Industrial +12 up to +24V supply / only for FF version: Power over Ethernet (POE)
  Operating Temperature: -20°C to +70°C
  Dimensions i-PAN T7 Baseboard: 164,0 x 92,0 x 17,0 mm (W x H x D)
  Dimensions Display: 201.0 x 133.0 x 8.7 mm (W x H x D)
  Environmental Standard: RoHS, REACH, WEEE
  Availability: 10 years form, function*