i-PAN X7 LC

Build-in industrial PanelPC solution

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  • Based on Trizeps SODIMM 200 CPU module technology with NXP i.MX 6 processor (before Freescale)
  • 7.0" projected capacitive touchscreen LCD with 2 mm mineral glass front, chemically-treated anti-reflective
  • Optimal touch functionality using an optical bonding process to bond the display to the glass pane
  • IP65 protection level for the frontside installation area
  • Peripherals: direct access via standard connectors
  • On request: Wireless communication
Technische Änderungen und Irrtümer vorbehalten | *Beginn Produkt-Lebenszyklus
Processor NXP i.MX 6 DualLite, Solo (Quad or Dual on request) / 800 MHz – 1.0 GHz (before from Freescale)
RAM Memory Up to 4 x 16 Bit DDR3-1066 (533MHz), 16/32/64 Bit 1 CS, 256 MByte to 1 GByte (2, 4 GByte on request)
Flash Storage Onboard 4 Bit wide μSD Socket with up to 32GB cards (standard) or onboard 8 Bit wide eMMC with 4GB up to 64GB (on request)
Features Display: 7.0" TFT-Display 800 x 480 pixel, projected capacitive touchscreen LCD, bonded behind 2 mm mineral glass using an optical bonding process
  Housing: Enclosure front with 2 mm on one side chemically-treated anti-reflective mineral glass, IP65 protection level for the installation area (dust and splash water), glass fibre reinforced plastic housing with backside metal cover, simple assembly with clamps on the back
  Interfaces: USB2.0 Host, USB2.0 OTG, HDMI v1.4 WUXGA, USB2.0 Header, RJ45 10/100 Mbit Ethernet, RS232 D-Sub 9, 3.5mm stereo audio headphone jack
  On request Wireless Communication: Trizeps VII option - Onboard WLAN and Bluetooth module, IEEE 802.11 a/b/g/n/e/i/h/d/k/r/w, +18 dBm, 72 Mbps (20 MHz) and up to 150 Mbps (40 MHz), Bluetooth 3.0+ EDR
Expandability pConXS LC Additional features and interfaces: USB2.0 Header, μSD card socket, FX11 high-speed board to board connector, I2C extension header, reset and user tactile switch, MiPi camera connector (Raspberry Pi)
  Extension connector interfaces: SL2-40 2.54mm Pin header – Power (3V3, 5V, Vin fused), GPIOs (1x with PWM), SPDIF (out and in), stereo headphone (16Ω and 32Ω), speaker (Mono, 8Ω), LineIn, microphone, 2x UARTs, 2x CAN, SDIO, I2C, 3x ADCs (external connectivity on request)
General Details Operating Systems: Microsoft Windows Embedded Compact 7 /
  Android JB 4.2.2 - 1.1.0 ASOP / Linux Ubuntu 14.04
  Voltage Supply: Industrial +12 up to +24V supply
  Operating Temperature: -20°C to +70°C
  Dimensions: 226 x 146 x 55 mm (W x H x D)
  Environmental Standard: RoHS, REACH, WEEE
  Availability: 10 years form, function*
  Order code: 39 100 (incl. pConXS LC baseboard, without Trizeps VII CPU module)

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