SOM (System On Module)
Keith & Koep offers you a wide range of SOM (System On Module) solutions based on System-on-a-Chips (SoC) with Arm architecture. Our SOMs are based on the i.MX series from NXP® and Qualcomm Snapdragon. With our modular system, we enable you to always rely on the latest technology.
- Reduced development effort
- Fast "Time to Market“
- Latest microprocessors & technology
- Long-term pin compatibility within the product families
- Extremely resistant connectors for particularly demanding applications
- Integrated Board Support Package (BSP)
- Windows Embedded operating systems, Windows 10 IoT Core, Android and Linux deployable
With the Trizeps and Myon CPU module families from Keith & Koep, you can expect a selection of high-performance, space- and cost-saving products. The product range keeps up with the development of new microprocessors and is constantly being expanded. The special feature is high computing power with relatively small dimensions. This means that in most cases the modules can be easily integrated into compact devices.
Pioneers of ARM based SOM technology
The world's first ARM-based SOM (System On Module) came from Keith & Koep. With the Trizeps, the idea of providing recurring core elements in a CPU module with a SODIMM form factor was implemented for the first time. With this system, development times could be significantly reduced and a faster "time-to-market" was realized.
This idea has been established step by step and is now used worldwide, e.g. in industrial and medical applications. Later, this system became an international industry standard. The first CPU module generation had the SODIMM 144 standard, which was subsequently replaced by the SODIMM 200 standard as a result of the need for more and more interfaces.
With the Myon module series, Keith & Koep launched a new SOM generation with a very compact form factor, allowing them to be easily integrated into high-performance IoT and battery-powered handheld devices.
Unlike most competitions, Keith & Koep offers actual comprehensive pin compatibility of the Trizeps modules among each other. Our SODIMM standard guarantees you the possibility to upgrade to a current Trizeps CPU module for years with little effort. The Keith & Koep SODIMM 200 standard is the longest established SODIMM standard worldwide and is adapted by various companies. We keep the standard up to the latest solutions Trizeps VIII Mini and Trizeps VIII Plus with i.MX 8M Mini and i.MX 8M Plus.
- All crucial components are available on the Trizeps and Myon CPU modules, thus reducing the hardware design effort on the customer side.
- The customer's remaining hardware design only includes interface connections in the form of a baseboard.
- Due to the nearly complete pin compatibility of the Trizeps or Myon CPU modules among each other, an upgrade to a current module is possible.
- The SODIMM contact system of the Trizeps CPU modules is absolutely "ruggedized" and is used in extreme scenarios.
- Due to their design, Trizeps and Myon CPU modules can be integrated into almost any housing. Thanks to their significantly smaller design compared to the Trizeps series, the Myon CPU modules are designed for very compact devices
- An early start of software development is enabled with a reference design of our evaluation kits or baseboards.
- The Board Support Package (BSP) developed by Keith & Koep allows the individual integration of customer-specific drivers. In addition, software development kits (SDK) are available for the development of customer applications.
- As a long-term Microsoft Gold Partner, we can quickly implement projects with Windows Embedded operating systems (CE 5.0, CE 6.0 R3, Compact 7 and 2013) as well as Windows 10 IoT Core.
- In addition to a Microsoft solution, Keith & Koep offers an Android/Linux development set. This set provides a virtual machine with Ubuntu LTS, which contains a specific BSP and can be used to generate an OS image for Trizeps or Myon CPU modules in a straightforward manner.