Myon I

Industrial SOM solution with Qualcomm® SnapdragonTM 410E QuadCore processor

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  • Available with Microsoft Windows 10 IoT Core, Linux and Android operating systems
  • Qualcomm® SnapdragonTM 410E low power CPU, 64bit, Cortex A53, QuadCore up to 1.2 GHz
  • Micro SOM solution for IoT/handheld devices
  • Supports e.g. LVDS and MIPI displays, MIPI camera
  • DirectX 12 graphics acceleration support for Windows 10 IoT Core
  • The i-PAN M7 CoverLens Touchpanel Computer and the ConXM baseboard provide e.g. an Ethernet interface
  • Pin compatible to Myon II CPU module
Technical modifications reserved, errors excepted | *beginning product life circle
Processor Qualcomm® SnapdragonTM 410E QuadCore ARM Cortex A53, up to 1.2GHz (APQ8016E), Qualcomm® AdrenoTM 306 400MHz GPU
RAM Memory 1 GByte LPDDR3 -1066 (533MHz), 32Bit, 2 Gbyte on request
Flash Storage 8 Gbyte eMMC, 16 Gbyte on request
Wireless Communication Onboard WLAN 802.11 b/g/n 2.4 GHz, Bluetooth 4.1, GPS functionality on request
  Options: On-board antennas or UFL connectors
Onboard Features Display Interfaces: LVDS or MIPI Display (4ch)
  Interfaces: USB2.0 OTG port (USB Host or Slave), SD/SDIO Card, MIPI Camera (2ch and 4Ch), 8 Ports configurable for different interfaces: GPIO, UART, SPI, I2C, I2S
  Extension Connectors: 2x 100pin Hirose DF40
  Audio Codec: Stereo Headphone output, Mono Speaker 8Ω, 3 Microphone inputs
  Power: PMIC to generate internal and external voltages / Lithium-ion, lithium-ion-polymer battery-charger / Coin-Cell charger
  Compatibility: Pin compatible to Myon II CPU module
General Details Operating Systems: Windows 10 IoT Core, Linux, Android
  Voltage Supply: LiPo 3 - 4.5V / typ. 3.3V / charger 5V
  Operating Temperature: -25°C ... +85°C (industrial)
  Dimensions : 48 x 32 x 4.2 mm without antennas / 58 x 32 x 4.2 mm with antennas (W x H x D)
  Environmental Standard: RoHS, REACH, WEEE
  Availability: 10 years form, fit, function*
Order codes: MIPI version incl. antennas: 40 024.MI00.H00S00
  LVDS version incl. antennas: 40 024.LV00.H00S00
  MIPI version without antennas: 40 024.MK00.H00S00
  LVDS version without antennas: 40 024.LK00.H00S00

Constantly high quality through multi-stage test of each individual CPU module

To ensure a constantly high quality, each individual CPU module is passed through a multi-stage test. The test result covers 100% of all interfaces.

  • AOI/MOI: Multiple automatic and manual optical control of each CPU module during the production.
  • JTAG/Boundary Scan Test: JTAG/Boundary Scan Test: The signal of each pin which is accessible via the JTAG chain is checked for connection, shorts, missing pull-up/down resistors. The DDR Ram is tested for row/column pin assignment.
  • Functional tests of high-speed and analog interfaces (Ethernet, display, USB, audio, etc.) which are not testable via JTAG, GPS test on request.

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