Trizeps VII SX

The new Trizeps VII CPU module with i.MX 6SoloX processor from NXP (before Freescale). It supports 2 Ethernet interfaces at the same time and has a low power consumption thanks the second Cortex M4 Core.

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  • Available with Microsoft Windows Embedded Compact 7, 2013, Linux and Android operating systems
  • NXP i.MX 6SoloX Cortex A9 up to 1.0 GHz and Cortex M4
  • Trizeps SODIMM-200 compatible
  • 2 Ethernet interfaces at the same time
  • Low Power
  • Battery charging option
  • Dual antenna +18dBm WiFi / BT
  • Audio codec and Ethernet PHY
Technical modifications reserved, errors excepted | *beginning product life circle
Processor NXP i.MX 6SoloX ARM Cortex A9 and Cortex M4, 800 MHz up to 1.0 GHz, 256 KB L2-Cache
RAM Memory 2x 16 Bit LVDDR3-1066 (533 MHz), 32 Bit 1 CS
  Options: 256 MByte up to 2 GByte, 32 Bit
Flash Storage Onboard 4 Bit wide μSD Socket (standard) or onboard 8 Bit wide eMMC (on request) – not all available at the same time
  Additional assembly option on request: Onboard SPI NOR Flash
  Options: μSD 4 GB (up to 32 GB) – eMMC-Type: 4 GB (up to 64 GB) – NOR Flash up to 512 Mbit
Wireless Communication Onboard WLAN-Bluetooth module, fits four different U-Blox module types (on request)
  Options: IEEE 802.11 a/b/g/n/e/i/h/d/k/r/w, +18 dBm, 72 Mbps (20 MHz) and up to 150 Mbps (40 MHz), Bluetooth 3.0+ EDR
Onboard Features Display Interfaces: LVDS, LCD 24 Bit RGB
  Interfaces: USB 2.0 Host and OTG, 2x FlexCAN, PCIe, 4 Bit wide SDIO, RTC, SPDIF, Adress-Data-Bus, 3x UARTs, 2x I2C, 2x SPI, GPIOs, 2x PWMs
  Ethernet: Onboard 10/100 Mbit RMII PHY and 10/100/1000 Mbit RGMII interface (can be used at the same time)
  Extension Connector: Additional FX11 60pol. high-speed board to board connector
  Camera Interfaces: 8bit parallel camera and analog camera interface
  Audio Codec: AC´97 Audio Codec with 4/5 wires res. Touch and 4x 12 Bit ADC (2x comparator inputs for battery monitoring), Stereo: Line-in, Mic-in, Speaker-out, Headphone out
  Power: High-Eff. PMIC with single supply controlled by I2C, battery management (optional)
  SODIMM200 Card Edge Connector: Pin compatible to Trizeps IV, IV-M, IV-WL, V, VI and VII CPU modules
General Details Operating Systems: Microsoft Windows Embedded Compact 7, 2013, Linux, Android
  Voltage Supply: +3V3 DC (SODIMM) or +5V DC and battery (FX11)
  Operating Temperature: -40°C bis +85°C (industrial)
  Board Dimensions: 67.6 x 36.7 x 6.4 mm (incl. μSD Socket)
  Environmental Standard: RoHS, REACH, WEEE
  Availability: 10 years form, fit, function*

Constantly high quality through multi-stage test of each individual CPU module

To ensure a constantly high quality, each individual CPU module is passed through a multi-stage test. The test result covers 100% of all interfaces.

  • AOI/MOI: Multiple automatic and manual optical control of each CPU module during the production.
  • JTAG/Boundary Scan Test: JTAG/Boundary Scan Test: The signal of each pin which is accessible via the JTAG chain is checked for connection, shorts, missing pull-up/down resistors. The DDR Ram is tested for row/column pin assignment.
  • Functional tests of high-speed and analog interfaces (Ethernet, display, USB, audio, etc.) which are not testable via JTAG, GPS test on request.

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