Trizeps VIII

The new Trizeps VIII uses the i.MX 8M processor from the NXP i.MX8 series. The CPU Module provides the high performance demands of current video, voice, and audio processing, either for industrial or home automation, streaming audio applications, or for modern imaging devices.

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  • Available with Linux and Android operating systems, Windows 10 IoT Core.
  • NXPTM i.MX 8M Arm® Quad-/Dual-Core Cortex A53 CPU up to 1.5 GHz, integrated Cortex M4
  • Configurable FPGA, e.g. with MIPI to RGB converter
  • Additional NXPTM Kinetis V Arm® Cortex M0+ MCU with e.g. CAN, ADC, SPI, I2C interfaces
  • Up to 4 GByte LPDDR4-3200 RAM, 32Bit
  • 1 GBit Ethernet, USB 3.0
  • Supports displays up to 4K
  • Onboard WiFi-Bluetooth module (optional)
  • LVDS (Single or Dual) Transceiver
  • Trizeps SODIMM-200 compatible, compact and scalable
Technical modifications reserved, errors excepted | *beginning product life circle
Processors CPU: NXP™ i.MX 8M with Arm® Quad-/Dual-Core Cortex™ A53 at up to 1.5GHz (consumer), 1.3GHz (industrial), integrated Cortex M4
  MCU: NXP Kinetis V Arm® Cortex-M0+ at up to 75MHz / 8x 16bit ADC, CAN, UART, SPI, GPIO etc. (optional)
RAM Memory Up to 8 GByte LPDDR4-3200, 32Bit
Flash Storage Onboard 4 Bit wide μSD Card Socket (recommendation) or onboard 8 Bit wide eMMC – not available at the same time
Wireless Communication Onboard WiFi-Bluetooth module (optional): WiFi 2.4GHz/5Ghz (optional), WLAN 802.11 a/b/g/n/ac 2x2 MU-MIMO / Bluetooth 4.2, 5.0, external chipsets for wireless communication can be connected via SDIO, PCIe or USB interfaces
Onboard Features Display Interfaces: HDMI v2.0a, MIPI display (4ch), Single-, Dual-LVDS or LCD 24 Bit RGB, supports displays up to 4k resolution
  Interfaces: 2x USB3.0 OTG, PCIe, 4Bit wide SDIO, SPDIF In/Out, I2S, Multichannel Serial-Audio-Interface, 4 UARTs, 2x I2C, SPI, QSPI, GPIOs, PWM
  Ethernet: Onboard 10/100MBit/1GBit RGMII PHY or SIOP interface
  FPGA: Programmable FPGA with up to 4300 LUTs to convert parallel display/camera/data-streams to MIPI DSI/CSI (optional)
  Extension Connector: Additional FX11 60pol. high-speed board to board connector
  Camera Interfaces: 8bit parallel, MIPI (4ch and additional 2ch)
  Audio Codec: Stereo Headphone output, Mono Speaker output, Stereo Line-In, Microphone input
  Power: High-Eff. PMIC with single supply controlled by I2C
  SODIMM200 Card Edge Connector: Pin compatible to Trizeps SODIMM-200 CPU modules
General Details System Software: Linux Kernel 4.14, Android 9, Windows 10 IoT Core
  Voltage Supply: +3V3 DC
  Operating Temperature: -40 bis 85°C (industrial) / -25 bis 85°C (Extended Consumer) / 0 bis 70°C (Consumer)
  Board Dimensions: 67.6 x 36.7 x 6.4 mm (W x H x D)
  Environmental Standard: RoHS, REACH, WEEE
  Availability: 10 years form, fit, function*

Constantly high quality through multi-stage test of each individual CPU module

To ensure a constantly high quality, each individual CPU module is passed through a multi-stage test. The test result covers 100% of all interfaces.

  • AOI/MOI: Multiple automatic and manual optical control of each CPU module during the production.
  • JTAG/Boundary Scan Test: JTAG/Boundary Scan Test: The signal of each pin which is accessible via the JTAG chain is checked for connection, shorts, missing pull-up/down resistors. The DDR Ram is tested for row/column pin assignment.
  • Functional tests of high-speed and analog interfaces (Ethernet, display, USB, audio, etc.) which are not testable via JTAG, GPS test on request.

SODIMM 200 Standard

The module features the Keith & Koep SODIMM 200 standard, which is the world's longest established SODIMM standard in the world. Like no other module standard, this one guarantees the extensive pin compatibility of the of the Trizeps modules with each other. This means that the module can also be used on older Keith & Koep platforms.

 

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