Trizeps VIII Mini

The new Trizeps VIII Mini CPU Module from the NXP i.MX8 series uses the i.MX 8M Mini processor, which provides the high performance demands of current video, voice, and audio processing, including video resolutions up to 1080p. The NXP iMX8M Mini CPU is produced in the 14nm LPC FinFET technology, which enables high operating frequencies in combination with a low power consumption.

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  • NXP i.MX 8M Mini Arm Quad-Core Cortex A53 CPU bis zu 1.8 GHz, mit integriertem Cortex M4
  • Konfigurierbarer FPGA (bis zu 4300 LUTs), u.a. mit MIPI zu RGB Konverter
  • NXP Kinetis V ARM Cortex M0+ MCU, stellt z.B. CAN, ADC, SPI, I2C Schnittstellen zur Verfügung
  • Bis zu 8 GByte LPDDR4-3200 Arbeitsspeicher, 32Bit
  • 1 GBit Ethernet, USB 2.0
  • Onboard WLAN/Bluetooth Modul
  • LVDS Transceiver (Single oder Dual)
  • Zusätzlicher HiFi Audio Codec
  • Geringer Strombedarf durch 14nm LPC FinFET-Technologie
  • Jedes CPU-Modul durchläuft einen mehrstufigen Test: AOI/MOI, JTAG/Boundary Scan Test, Funktionstests
  • Als Betriebssysteme sind Linux, Android und Windows 10 IoT Core verfügbar.

The Trizeps VIII Mini adds further features with the configurable FPGA, the programmable NXP Kinetis Cortex M0+ MCU, the LVDS transceiver, the Hi-Fi Audio Codec and the onboard WiFi-Bluetooth module. This integrates e.g. CAN, ADC, SPI, I2C interfaces as well as RBG and LVDS displays in addition to the iMX8M Mini CPU functionality.

Therefore, the Trizeps VIII Mini is the ideal CPU module for typical embedded solutions such as industrial-/ home automation, robotics, automotive, medical, aerospace, retail and is also ideally suitable for current streaming, audio applications, modern imaging devices or handhelds as well as battery-powered solutions.

Technical modifications reserved, errors excepted | *beginning product life circle
Processors CPU: NXP™ i.MX 8M Mini with Arm® Quad-Core Cortex™ A53 at up to 1.8GHz (consumer), 1.6GHz (industrial), with integrated Cortex™ M4
  MCU: NXP™ Kinetis V Arm® Cortex™ M0+ at up to 75MHz / 8x 16bit ADC, CAN, UART, SPI, GPIO etc. (optional)
RAM Memory Up to 8 GByte LPDDR4-3200, 32Bit
Flash Storage Onboard 4 Bit wide μSD Card Socket (recommendation) or onboard 8 Bit wide eMMC – not available at the same time
Wireless Communication Onboard WiFi-Bluetooth module (optional): WiFi 2.4 GHz / 5Ghz, 802.11 a/b/g/n/ac 2x2 MU-MIMO / Bluetooth 4.2, 5.0, external chipsets for wireless communication can be connected via SDIO, PCIe or USB interfaces
Onboard Features Display Interfaces: MIPI display (4ch), Single-, Dual-LVDS or LCD 24 Bit RGB
  Interfaces: 2x USB2.0 OTG, PCIe (routed to SODIMM socket or connected to WLAN-Bluetooth module), 4 Bit wide SDIO, SPDIF In/Out, I2S, Multichannel Serial-Audio-Interface, 4x UART, 2x I2C, SPI, QSPI, GPIOs, PWM
  Ethernet: Onboard 10/100MBit/1GBit RGMII PHY or SIOP interface
  FPGA: Programmable FPGA with up to 4300 LUTs to convert parallel display/camera/data-streams to MIPI DSI/CSI (optional)
  Extension Connector: Additional FX11 60pol. high-speed board to board connector
  Camera Interfaces: 8bit parallel, MIPI Camera (4ch)
  Audio Codec: Stereo Headphone output, Mono Speaker output, Stereo Line-In, Microphone input
  Power: High-Eff. PMIC with single supply controlled by I2C
  SODIMM200 Card Edge Connector: Pin compatible to Trizeps SODIMM-200 CPU modules
General Details System Software: Linux Kernel 4.14, Android 9, Windows 10 IoT Core
  Voltage Supply: +3V3 DC
  Operating Temperature: -40 … 85°C (Industrial) / -25 … 85°C (Extended Consumer) / 0 … 70°C (Consumer)
  Board Dimensions:67.6 x 36.7 x 6.4 mm (W x H x D)
  Environmental Standard: RoHS, REACH, WEEE
  Availability: 10 years form, fit, function*

Constantly high quality through multi-stage test of each individual CPU module

To ensure a constantly high quality, each individual CPU module is passed through a multi-stage test. The test result covers 100% of all interfaces.

  • AOI/MOI: Multiple automatic and manual optical control of each CPU module during the production.
  • JTAG/Boundary Scan Test: JTAG/Boundary Scan Test: The signal of each pin which is accessible via the JTAG chain is checked for connection, shorts, missing pull-up/down resistors. The DDR Ram is tested for row/column pin assignment.
  • Functional tests of high-speed and analog interfaces (Ethernet, display, USB, audio, etc.) which are not testable via JTAG, GPS test on request.

SODIMM 200 Standard

The module features the Keith & Koep SODIMM 200 standard, which is the world's longest established SODIMM standard in the world. Like no other module standard, this one guarantees the extensive pin compatibility of the of the Trizeps modules with each other. This means that the module can also be used on older Keith & Koep platforms.

 

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