Trizeps VIII Nano

The new Trizeps VIII Nano CPU Module from the NXP i.MX8 series uses the i.MX 8M Nano processor, which provides the high performance demands of current video, voice, and audio processing, including video resolutions up to 1080p. The NXP iMX8M Nano CPU is produced in the 14nm LPC FinFET technology, which enables high operating frequencies in combination with a low power consumption.

Main differences to Trizeps VIII Mini with i.MX 8M Mini CPU: 16Bit LPDDR4 RAM instead of 32Bit, only one USB interface, no PCIe interface, Cortex M7 instead of M4 co-processor

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The Trizeps VIII Nano adds further features with the configurable FPGA, the programmable NXP Kinetis Cortex M0+ MCU, the LVDS transceiver and the Hi-Fi Audio Codec. This integrates e.g. CAN, ADC, SPI, I2C interfaces as well as RBG and LVDS displays in addition to the iMX8M Nano CPU functionality.

Therefore, the Trizeps VIII Nano is the ideal CPU module for typical embedded solutions such as industrial-/ home automation, robotics, automotive, medical, aerospace, retail and is also ideally suitable for current streaming, audio applications, modern imaging devices or handhelds as well as battery-powered solutions.

  • Available with Linux, Android and Windows 10 IoT Core operating systems
  • NXP i.MX 8M Nano ARM Cortex A53 CPU up to 1.5 GHz, with integrated Cortex M7
  • Configurable FPGA (up to 4300 LUTs), e.g. with MIPI to RGB converter
  • NXP Kinetis V ARM Cortex M0+ MCU provides additional interfaces like CAN, ADC, SPI, I2C
  • Up to 4 GByte LPDDR4-3200 RAM, 16 Bit
  • 1 GBit Ethernet, USB 2.0
  • LVDS Transceiver (Single or Dual)
  • Additional Hi-Fi Audio Codec
  • Low power consumption via 14nm LPC FinFET technology
  • Each CPU module passes through a multi-stage test: AOI/MOI, JTAG/Boundary Scan Test, Functional Tests

Main differences to Trizeps VIII Mini with i.MX 8M Mini CPU: 16Bit LPDDR4 RAM instead of 32Bit, only one USB interface, no PCIe interface, Cortex M7 instead of M4 co-processor

Technical modifications reserved, errors excepted | *beginning product life circle
Processors CPU: NXP™ i.MX 8M Nano with Arm® Quad-Core Cortex™ A53 at up to 1.5GHz (consumer), 1.4GHz (industrial), with integrated Cortex™ M7
  MCU: NXP™ Kinetis V Arm® Cortex™ M0+ at up to 75MHz / 8x 16bit ADC, CAN, UART, SPI, GPIO etc. (optional)
RAM Memory Up to 4 GByte LPDDR4-3200, 16Bit
Flash Storage Onboard 4 Bit wide μSD Card Socket (recommendation) or onboard 8 Bit wide eMMC – not available at the same time
Wireless Communication No onboard WiFi-Bluetooth module available, external chipsets for wireless communication can be connected via SDIO or USB interfaces
Onboard Features Display Interfaces: MIPI display (4ch), Single-, Dual-LVDS or LCD 24 Bit RGB
  Interfaces: USB2.0 OTG, 4 Bit wide SDIO, SPDIF In/Out, I2S, Multichannel Serial-Audio-Interface, 4x UART, 2x I2C, SPI, QSPI, GPIOs, PWM
  Ethernet: Onboard 10/100MBit/1GBit RGMII PHY or SIOP interface
  FPGA: Programmable FPGA with up to 4300 LUTs to convert parallel display/camera/data-streams to MIPI DSI/CSI (optional)
  Extension Connector: Additional FX11 60pol. high-speed board to board connector
  Camera Interfaces: 8bit parallel, MIPI Camera (4ch)
  Audio Codec: Stereo Headphone output, Mono Speaker output, Stereo Line-In, Microphone input
  Power: High-Eff. PMIC with single supply controlled by I2C
  SODIMM200 Card Edge Connector: Pin compatible to Trizeps SODIMM-200 CPU modules
General Details System Software: Linux Kernel 4.14, Android 9, Windows 10 IoT Core
  Voltage Supply: +3V3 DC
  Operating Temperature: -40 … 85°C (Industrial) / -25 … 85°C (Extended Consumer) / 0 … 70°C (Consumer)
  Board Dimensions: 67.6 x 36.7 x 6.4 mm (W x H x D)
  Environmental Standard: RoHS, REACH, WEEE
  Availability: 10 years form, fit, function*

Constantly high quality through multi-stage test of each individual CPU module

To ensure a constantly high quality, each individual CPU module is passed through a multi-stage test. The test result covers 100% of all interfaces.

  • AOI/MOI: Multiple automatic and manual optical control of each CPU module during the production.
  • JTAG/Boundary Scan Test: JTAG/Boundary Scan Test: The signal of each pin which is accessible via the JTAG chain is checked for connection, shorts, missing pull-up/down resistors. The DDR Ram is tested for row/column pin assignment.
  • Functional tests of high-speed and analog interfaces (Ethernet, display, USB, audio, etc.) which are not testable via JTAG, GPS test on request.

SODIMM 200 Standard

The module features the Keith & Koep SODIMM 200 standard, which is the world's longest established SODIMM standard in the world. Like no other module standard, this one guarantees the extensive pin compatibility of the of the Trizeps modules with each other. This means that the module can also be used on older Keith & Koep platforms.

 

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