Trizeps VIII Plus
The new Trizeps VIII Plus CPU module uses the new i.MX 8M Plus processor from the NXP i.MX8 series. The i.MX 8M Plus SoC (System on Chip) has various processor units that can handle a wide range of computing operations.
- NXP i.MX 8M Plus Arm Cortex A53 Quad-Core CPU up to 1.8 GHz, integrated Cortex M7
- Integrated NPU (Neural Processing Unit), 2 integrated ISPs (Image Signal Processor)
- Configurable FPGA (up to 4300 LUTs)
- Additional NXP Kinetis V Arm Cortex M0+ MCU
- Up to 8 GByte LPDDR4-4000 RAM, 32 Bit
- 2x GBit Ethernet, 2x USB 3.0, 2x CAN-FD, PCIe
- Multi-Display and Multi-Camera
- Additional analog Hi-Fi Audio Codec
- Onboard WiFi/Bluetooth module
- Low power consumption via 14nm LPC FinFET technology
- Available with Linux, Android and Windows 10 IoT Core operating systems.
Of particular note is the NPU (Neural Processing Unit), which can handle computational processes in the field of AI (Artificial Intelligence) typically with learned neural networks. These can be used for pattern, speech and object recognition. and object recognition. This opens up new areas of application for the Trizeps VIII Plus SOM (System On Module).
Equally important is the wide range of applications for the classic embedded functions. This is where the Dual Gigabit Ethernet and Dual CAN FD interfaces, which are used e.g. in industrial automation, are convincing. "Low power" applications or real-time applications can be provided by the integrated 800 MHz clocked Arm Cortex-M7 co-processor. USB 3.0 and PCIe are available as high-speed interfaces.
The Trizeps VIII Plus can also be used for a wide range of multimedia applications. The powerful 2D and 3D GPUs (graphics processing units) enable the simultaneous use of multiple displays and cameras that can be integrated independently of each other. Fast image processing is enabled by high-performance video decoders and encoders as well as two image signal processors (Dual-ISP - Dual Image Signal Processor). Also, powerful audio and voice functions are available. Displays can be connected via HDMI, (dual-)LVDS or MIPI-DISI interfaces.
Besides, the Trizeps VIII Plus extends the functionality of the i.MX 8M Plus SoC with the configurable FPGA, the programmable Kinetis Cortex M0+ MCU, the HiFi Audio Codec and the WLAN/Bluetooth module.
|Processors||SoC: NXP™ i.MX 8M Plus with Arm® Cortex A53 Quad-Core CPU up to 1.8 GHz (consumer), 1.6 GHz (industrial), integrated Arm® Cortex M7 Co-Processor up to 800 MHz for Low-Power and Realtime applications, integrated NPU (Neural Processing Unit) with 2.3 TOP/s, 2 integrated ISPs (Image Signal Processor), resolution up to 12 MPixels and input rate up to 375 MPixels/s|
|MCU (optional)): NXP™ Kinetis V Arm® Cortex-M0+ up to 75 MHz / 8x 16 Bit ADC, UART, SPI, GPIO, I2C etc.|
|RAM Memory||Up to 8 GByte LPDDR4-4000, 32 Bit|
|Flash Storage||Onboard 4 Bit wide μSD Card Socket or onboard 8 Bit wide eMMC|
|Wireless Communication||Onboard WiFi/Bluetooth module, WiFi 2.4 GHz / 5Ghz, 802.11 a/b/g/n/ac 2x2 MU-MIMO / Bluetooth 4.2, 5.0 / External chipsets for wireless communication can be connected via SDIO, PCIe or USB interfaces (optional)|
|Onboard Features||Interfaces: 2x USB 3.0 OTG, PCIe (routed to SODIMM socket or connected to WiFi-Bluetooth module), 3x 4 Bit wide SDIO 3.0, SPDIF In/Out, I2S, Multichannel Serial-Audio-Interface, 4x UART, 2x I2C, SPI, QSPI, GPIOs, PWMs, 2x CAN|
|Ethernet: Onboard 10/100MBit/1GBit RGMII PHY / Additional 10/100MBit/1GBit RGMII interface|
|FPGA (optional): Programmable FPGA, up to 4300 LUTs|
|Display: Interfaces: HDMI, MIPI display (4 channel) / Single- or Dual-LVDS, LCD 24 Bit RGB GPU: 16 GFLOPS (high-precision) OpenGL® ES 3.1/3.0, Vulkan®, Open CL™ 1.2 FP, OpenVG™ 1.1 Video-Decoder: 1080p60, h.265/4, VP9, VP8|
|Camera Interfaces: 2x MIPI-CSI (4 channel) / Video Encoder: 1080p60, h.265/4|
|Audio Codec: Digital: 18x I2S TDM, DSD512, S/PDIF Tx + Rx, 8 channel PDM Microphone input Analog: Stereo Headphone output, Mono Speaker output, Stereo Line-In, Microphone input|
|Power: High-Eff . PMIC with single supply controlled by I2C|
|SODIMM Standard: SODIMM200 Card Edge connector, pin compatible to Trizeps SODIMM-200 CPU modules / FX11 60 pol. high-speed board to board connector|
|General Details||System Software: Linux Yocto, Debian / Android / Windows 10 IoT|
|Voltage Supply: +3V3 DC|
|Operating Temperature: -40 bis 85°C (industrial) / -25 bis 85°C (Extended Consumer) / 0 bis 70°C (Consumer)|
|Board Dimensions: 67.6 x 36.7 x 6.4 mm (W x H x D)|
|Environmental Standard: RoHS, REACH, WEEE|
|Availability: 10 years form, fit, function*|
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